| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| IEICE-ICD, IEICE-SDM, IST [detail] |
2022-08-08
09:00 |
Online |
On-line |
[Invited Talk]
A 2-Layer Transistor Pixel Stacked CMOS Image Sensor with Oxide Based Full Trench Isolation for Large Full Well Capacity and High Quantum Efficiency
Koichiro Zaitsu, Akira Matsumoto, Mizuki Nishida, Yusuke Tanaka, Hirofumi Yamashita, Yosuke Satake (Sony Semiconductor Solutions), Takashi Watanabe, Kunihiko Araki, Naoki Nei (Sony Semiconductor Manufacturing), Keiichi Nakazawa, Junpei Yamamoto, Mutsuo Uehara (Sony Semiconductor Solutions), Hiroyuki Kawashima, Yusaku Kobayashi (Sony Semiconductor Manufacturing), Tomoyuki Hirano, Keiji Tatani (Sony Semiconductor Solutions) |
[more] |
|
| IEICE-ICD, IEICE-SDM, IST [detail] |
2022-08-08
09:45 |
Online |
On-line |
[Invited Talk]
Low-Noise Multi-Gate Pixel Transistor for Sub-Micron Pixel CMOS Image Sensors
Naohiko Kimizuka, Shota Kitamura, Akiko Honjo, Koichi Baba, Toshihiro Kurobe, Hideomi Kumano, Takuya Toyohuku (Sony Semiconductor Solutions), Kouhei Takeuchi, Shota Nishimura (Sony Semiconductor Manufacturing), Akihiko Kato, Tomoyuki Hirano, Yusuke Oike (Sony Semiconductor Solutions) |
[more] |
|
| IEICE-MRIS, MMS |
2022-06-09
13:55 |
Miyagi |
RIEC, Tohoku Univ.
(Primary: On-site, Secondary: Online) |
M-H curve and Read-Write Simulations considering Thermal Agitation
Ikuya Tagawa (TohTech), Satoshi Kodama, Junichi Tachibana, Takashi Aizawa, Minoru Yamaga (SSMS) |
[more] |
|
| IST |
2022-03-28
09:05 |
Online |
|
A 4.9Mpixel Programmable-Resolution Multi-Purpose CMOS Image Sensor for Computer Vision
Hirotaka Murakami, Eric Bohannon, John Childs, Grace Gui, Eric Moule (SEL), Katsuhiko Hanzawa (SSS), Tomofumi Koda (SEL), Chiaki Takano (SSS), Toshimasa Shimizu, Yuki Takizawa (SLSI), Adarsh Basavalingappa, Robert Childs, Cody Cziesler, Robert Jarnot (SEL), Kazumasa Nishimura (SLSI), Scott Rogerson, Yoshikazu Nitta (SEL) |
Today’s mobile devices are capable of multiple tasks, including viewing and computer vision. However, these tasks are of... [more] |
IST2022-10
pp.1-4 |
| IST |
2022-03-28
09:55 |
Online |
|
3D Sequential Process Integraton for CMOS Image Sensor
Keiichi Nakazawa, Junpei Yamamoto, Shigetaka Mori, Shintarou Okamoto, Akito Shimizu, Koichi Baba, Nobutoshi Fujii, Mutsuo Uehara, Katsunori Hiramatsu, Hideomi Kumano, Akira Matsumoto, Kouichirou Zaitsu, Hidetoshi Ohnuma, Keiji Tatani, Tomoyuki Hirano, Hayato Iwamoto (Sony Semconductor Solutions Corp.) |
We developed a new structure of pixel transistors stacked over photodiode named “2-Layer Transistor Pixel Stacked CMOS I... [more] |
IST2022-12
pp.9-12 |
| IST |
2022-03-28
13:40 |
Online |
|
A 2.9μm Pixel CMOS Image Sensor for Security Cameras with high FWC and 97 dB Single-Exposure Dynamic Range
Masashi Ohura, Tetsuya Uchida, Kazuyoshi Yamashita, Atsushi Masagaki, Tomohiko Kawamura, Chie Tokumitsu, Takashi Onizawa, Hisahiro Ansai, Kazutaka Izukashi, Shinichi Yoshida (SSS), Takamasa Tanikuni, Susumu Hiyama (SCK), Tomoyuki Hirano, Shinji Miyazawa, Yasushi Tateshita (SSS) |
[more] |
IST2022-17
pp.31-34 |
| IST |
2022-03-28
15:40 |
Online |
|
A Back Illuminated 6 μm SPAD Pixel Array with High PDE and Timing Jitter Performance
Shohei Shimada, Yusuke Otake, Satoru Yoshida, Suzunori Endo, Ryoichi Nakamura, Hidenobu Tsugawa, Tomohiro Ogita, Takayuki Ogasahara, Kaito Yokochi, Yuji Inoue, Kosaku Takabayashi, Hidenori Maeda, Koji Yamamoto, Makoto Ono, Shizunori Matsumoto, Hiroki Hiyama, Toshifumi Wakano (Sony) |
We present a high-performance Single Photon Avalanche Diode (SPAD) pixel array sensor with 3D-stacked Back Illumination ... [more] |
IST2022-20
pp.43-46 |
| IEICE-SDM, IEICE-ICD, IST [detail] |
2021-08-18
09:30 |
Online |
Online |
[Invited Talk]
Analog in-memory computing in FeFET based 1T1R array for low-power edge AI applications
Daisuke Saito, Toshiyuki Kobayashi, Hiroki Koga (SONY), Yusuke Shuto, Jun Okuno, Kenta Konishi (SSS), Masanori Tsukamoto, Kazunobu Ohkuri (SONY), Taku Umebayashi (SSS), Takayuki Ezaki (SONY) |
[more] |
|
| IST |
2021-03-26
12:50 |
Tokyo |
Online |
A Back Illuminated 10μm SPAD Pixel Array Comprising Full Trench Isolation and Cu-Cu Bonding with Over 14% PDE at 940nm
Kyosuke Ito, Yusuke Otake, Yoshiaki Kitano, Akira Matsumoto, Junpei Yamamoto, Takayuki Ogasahara, Hiroki Hiyama, Ryusei Naito, Kohei Takeuchi, Takanori Tada, Kosaku Takabayashi, Hajime Nakayama, Keiji Tatani, Tomoyuki Hirano, Toshifumi Wakano (SONY) |
A state of the art Back Illuminated (BI) Single Photon Avalanche Diode (SPAD) array sensor realized via a 90nm CMOS proc... [more] |
IST2021-14
pp.25-28 |
| IST |
2021-03-26
13:15 |
Tokyo |
Online |
A 189×600 Back-Illuminated Stacked SPAD Direct Time-of-Flight Depth Sensor for Automotive LiDAR Systems
Oichi Kumagai, Junichi Ohmachi, Masao Matsumura, Shinichiro Yagi, Kenichi Tayu (Sony Semiconductor Solutions), Keitaro Amagawa (Sony LSI Design), Tomohiro Matsukawa, Osamu Ozawa, Daisuke Hirono, Yasuhiro Shinozuka, Ryutaro Homma (Sony Semiconductor Solutions), Kumiko Mahara (Sony LSI Design), Toshio Ohyama, Yousuke Morita, Shohei Shimada (Sony Semiconductor Solutions), Takahisa Ueno (Sony Depthsensing Solutions), Akira Matsumoto, Yusuke Otake, Toshifumi Wakano, Takashi Izawa (Sony Semiconductor Solutions) |
[more] |
IST2021-15
pp.29-32 |
| IST |
2021-03-26
13:45 |
Tokyo |
Online |
Low power consumption and high resolution 1280X960 Gate Assisted Photonic Demodulator pixel for indirect Time of flight
Yoshiki Ebiko (SSS) |
[more] |
IST2021-16
pp.33-37 |
| IST |
2021-03-26
14:10 |
Tokyo |
Online |
A 250fps 124dB Dynamic-Range SPAD Image Sensor Stacked with Pixel-Parallel Photon Counter Employing Subframe Extrapolating Architecture for Motion Artifact Suppression
Kazuki Hizu, Jun Ogi, Takafumi Takatsuka, Yutaka Inaoka, Hongbo Zhu, Yasuhisa Tochigi, Yoshiaki Tashiro, Fumiaki Sano (Sony Semiconductor Solutions), Yusuke Murakawa, Makoto Nakamura (Sony Semiconductor Manufacturing), Yusuke Oike (Sony Semiconductor Solutions) |
[more] |
IST2021-17
pp.39-42 |
| IST |
2021-03-26
15:00 |
Tokyo |
Online |
[Invited Talk]
Evolving Image Sensor Architecture through Stacking Devices
Yusuke Oike (Sony) |
The evolution of CMOS image sensors and the prospects utilizing advanced imaging technologies promise to improve our qua... [more] |
IST2021-18
p.43 |
| IST |
2021-03-26
15:50 |
Tokyo |
Online |
|
[more] |
IST2021-19
pp.45-48 |
| IEICE-ICD, IEICE-SDM, IST [detail] |
2020-08-06
09:30 |
Online |
Online |
[Invited Talk]
SoC compatible 1T1C FeRAM memory array based on ferroelectric Hf0.5Zr0.5O2
-- Report on 2020 IEEE VLSI Symposia --
Jun Okuno, Takafumi Kunihiro, Kenta Konishi, Fumitaka Sugaya, Yusuke Shuto, Hideki Maemura, Masanori Tsukamoto, Taku Umebayashi (SSS) |
[more] |
|
| IST |
2020-03-27
09:00 |
Tokyo |
Kikaishinko kaikan
(Postponed) |
A 1/2inch 48M All PDAF CMOS Image Sensor Using 0.8μm Quad Bayer Coding 2×2OCL with 1.0lux Minimum AF Illuminance Level
Tatsuya Okawa, Susumu Ooki, Hiroaki Yamajo, Masakazu Kawada, Masayuki Tachi, Kazuhiro Goi, Takatsugu Yamasaki, Hiroki Iwashita, Masahiko Nakamizo, Takayuki Ogasahara, Yoshiaki Kitano, Keiji Tatani (Sony) |
Currently, there are two coding trends in mobile image sensors: Quad Bayer coding (QBC) and dual photodiode (DPD). QBC r... [more] |
IST2020-8
pp.1-5 |
| IST |
2020-03-27
09:50 |
Tokyo |
Kikaishinko kaikan
(Postponed) |
A 1280 x 720 Back-Illuminated Stacked Temporal Contrast Event-based Vision Sensor with 4.86μm Pixels, 1.066GEPS Readout, Programmable Event Rate Controller and Compressive Data Formatting Pipeline
Thomas Finateu (Prophesee), Atsumi Niwa (Sony), Daniel Matolin (Prophesee), Koya Tsuchimoto (Sony), Andrea Mascheroni, Etienne Reynaud (Prophesee), Pooria Mostafalu, Frederick Brady (Sony), Ludovic Chotard, Florian LeGoff (Prophesee), Hirotsugu Takahashi, Hayato Wakabayashi, Yusuke Oike (Sony), Christoph Posch (Prophesee) |
Event-based vision and image sensors, due to large circuitry in each pixel, benefit from wafer-stacking to achieve compe... [more] |
IST2020-10
pp.13-16 |
| IST |
2020-03-27
13:30 |
Tokyo |
Kikaishinko kaikan
(Postponed) |
High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer
Shunsuke Maruyama, Shuji Manda, Ryosuke Matsumoto, Suguru Saito, Hideki Minari, Takaaki Hirano, Taizo Takachi, Nobutoshi Fujii, Yuichi Yamamoto, Yoshifumi Zaizen, Tomoyuki Hirano, Hayato Iwamoto (SSS) |
We developed a back-illuminated InGaAs image sensor with 1280x1024 pixels at 5-um pitch by using Cu-Cu hybridization con... [more] |
IST2020-16
pp.35-39 |
| IST |
2020-03-27
13:55 |
Tokyo |
Kikaishinko kaikan
(Postponed) |
Three-layer Stacked Color Image Sensor With 2.0-μm Pixel Size Using Organic Photoconductive Film
Taiichiro Watanabe, Hideaki Togashi, Masahiro Joei, Toshihiko Hayashi, Shintaro Hirata, Shinpei Fukuoka, Yoshihiro Ando, Yusuke Sato, Junpei Yamamoto, Iwao Yagi, Masaki Murata (SSS), Miki Kuribayashi (SONY), Fumihiko Koga, Tetsuji Yamaguchi, Yusuke Oike (SSS), Takayuki Ezaki, Teruo Hirayama (SONY) |
[more] |
IST2020-17
pp.41-45 |
| IST |
2020-03-27
17:00 |
Tokyo |
Kikaishinko kaikan
(Postponed) |
A 0.5e-rms Noise 1.45um-Pitch CMOS Image Sensor with Reference Shared In-Pixel Differential Amplifier at 8.3Mpixel 35fps
Hideki Naganuma, Mamoru Sato, Yuhi Yorikado, Yusuke Matsumura, Eriko Kato, Takuya Toyofuku, Akihiko Kato, Yusuke Oike (SSS) |
We fabricated a 1.45-um pixel, back-illuminated stacked 1/2.8-inch CIS that uses a reference-shared in-pixel differentia... [more] |
IST2020-24
pp.77-80 |
|