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Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
IST |
2018-09-25 15:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Backside illuminated, three dimensional stacked single photon avalanche diode technology in 45nm CMOS Yuichiro Yamashita (TSMC), Myung-Jae Lee (EPFL), Augusto Ronchini Ximenes (TUDelft), Preethi Padmanabhan (EPFL), Tzu-Jui Wang,, Kuo-Chin Huang,, Dun-Nian Yaung (TSMC), Edoardo Charbon (EPFL) |
[more] |
IST2018-51 pp.17-20 |
IST |
2016-11-17 16:30 |
Tokyo |
TITECH Tamachi Campus |
[Poster Presentation]
Poster, A Dedicated Image Processing Engine Stacked with CMOS Image Array at 40nm CMOS Imager Technologies Biay-Cheng Hseih, Khoi Le, Keith Honea, Sergio Goma (QCOM), RJ Lin, Chin-Hao Chang, Kuo-Yu Chou, Calvin Chao (TSMC), Sami Khawam, Hasib Siddiqui (QCOM) |
[more] |
IST2016-50 pp.5-6 |
IST |
2016-03-11 11:40 |
Tokyo |
NHK Research Lab (Setagaya) |
A 1.1μm 33Mpixel 240fps 3D-Stacked CMOS Image Sensor with 3-Stage Cyclic-Based Analog-to-Digital Converters Toshiki Arai, Toshio Yasue, Kazuya Kitamura, Hiroshi Shimamoto (NHK STRL), Tomohiko Kosugi, Sungwook Jun, Satoshi Aoyama (Brookman Technology), Ming-Chieh Hsu, Yuichiro Yamashita (TSMC), Hirofumi Sumi (The University of Tokyo), Shoji Kawahito (Shizuoka University) |
A 1.1μm 33Mpixel 240fps 3D-stacked CMOS image sensor with 3-stage cyclic-based ADC has been developed. The hybrid-stacki... [more] |
IST2016-12 pp.21-24 |
IST |
2015-09-18 10:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The source decomposition of Dark FPN and its improvement by Stacked CIS process Yuichiro Yamashita, Wen-hau Wu, Wen-jen Chiang, Chi-hsien Chung, Ren-jie Lin, Jhy-jyi Sze, Jen-cheng Liu, Cheng-hsien Tseng, Hirohumi Sumi (TSMC), Sho-gwo Wuu |
[more] |
IST2015-46 pp.13-15 |
IST |
2014-09-29 13:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Advanced 1.1um Pixel CMOS Image Sensor with 3D Stacked Architecture J. C. Liu, D. N. Yaung, J. J. Sze, C. C. Wang, G. Hung, C. J. Wang, T. H. Hsu, T. J. Wang, W. D. Wang, H. Y. Cheng, J. S. Lin, S. J. Tsai, Y. P. Chao, S. G. Wuu, Y. Yamashita (TSMC) |
[more] |
IST2014-40
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