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Committee Date Time Place Paper Title / Authors Abstract Paper #
IST 2020-03-27
Tokyo Kikaishinko kaikan
High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer
Shunsuke Maruyama, Shuji Manda, Ryosuke Matsumoto, Suguru Saito, Hideki Minari, Takaaki Hirano, Taizo Takachi, Nobutoshi Fujii, Yuichi Yamamoto, Yoshifumi Zaizen, Tomoyuki Hirano, Hayato Iwamoto (SSS)
We developed a back-illuminated InGaAs image sensor with 1280x1024 pixels at 5-um pitch by using Cu-Cu hybridization con... [more] IST2020-16
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