ITE Technical Group Submission System
Conference Schedule |
Online Proceedings
[Sign in]
|
|
|
|
|
All Technical Committee Conferences (Searched in: All Years)
|
|
|
| Search Results: Conference Papers |
| Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
|
|
| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| BCT, IEICE-SIS |
2021-10-08
10:50 |
Online |
online |
A Study on Contrast Enhancement of Images for SfM
Kazuaki Takahashi, Masaaki Fujiyoshi (Tokyo Metro. Univ.) |
This paper investigates the application of contrast enhancement to photographs for structure from motion (SfM), where Sf... [more] |
|
| AIT, IIEEJ, AS, CG-ARTS |
2020-03-13
12:50 |
Tokyo |
Tokyo University of Technology
(Cancelled) |
VR system for observing the ferocity of Typhoon on Environment
Antong Yang, Midori Yano, Tubasa Kohyama, Takayuki Itoh (Ochanomizu Univ.) |
Visualization techniques are often used to understand observed and simulated weather data. Traditionally, two-dimensiona... [more] |
AIT2020-105
pp.189-191 |
| IST |
2014-03-14
11:30 |
Tokyo |
NHK |
3D Stacked CMOS Image Sensor
Taku Umebayashi, Tomoharu Ogita, Shunichi Sukegawa, Tsutomu Nakajima, Hiroshi Kawanobe (Sony), Ken Koseki (Sony LSI Design), Tsutomu Haruta, Hiroshi Takahashi (Sony), Keishi Inoue (Sony Semiconductor), Toshifumi Wakano, Yusuke Mada, Koji Fukumoto, Takashi Nagano, Yoshikazu Nitta, Teruo Hirayama (Sony) |
We have developed 3D stacked CMOS image sensor. This technology is a Back-illuminated CIS stacking on a logic substrate.... [more] |
IST2014-9
p.5 |
| IST |
2014-03-14
12:00 |
Tokyo |
NHK |
Three-dimensional Structures for High Saturation Signals and Crosstalk Suppression in 1.20 um Pixel Back-Illuminated CMOS Image Sensor
Takekazu Shinohara, Kazufumi Watanabe (Sony Semiconductor), Takashi Abe, Kazunobu Ohta (Sony), Hajime Nakayama (Sony Semiconductor), Takafumi Morikawa, Keiichi Ohno (Sony), Dai Sugimoto (Sony Semiconductor), Shingo Kadomura, Teruo Hirayama (Sony) |
We propose two technologies, vertical transfer gate (VTG) and buried shielding metal (BSM), that can be applied to 1.20 ... [more] |
IST2014-10
pp.7-10 |
|
|
|
|
|
[Return to Top Page]
[Return to ITE Web Page]
|