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Committee Date Time Place Paper Title / Authors Abstract Paper #
IEICE-ICD, IEICE-SDM, IST [detail] 2026-08-06
10:00		 Hokkaido Hokkaido Univ, Pharmaceutical Sciences, Lecture Room 2
(Primary: On-site, Secondary: Online)		 [Invited Talk] A Multi-Stacked Cell Array Architecture with Wafer-to-Wafer Cu Direct Bonding for Ultra-High-Density 3D Flash Memory beyond 1,000 Word Lines
Mitsuhiko Noda, Susumu Hashimoto, Ryuta Mizumoto, Mamoru Watanabe, Genki Sawada, Kanta Kawasaki, Masahisa Sonoda, Eiji Kamiya, Tetsu Morooka, Keisuke Nakatsuka, Hiroshi Maejima, Shigeki Kobayashi, Shinji Suzuki (Kioxia), Yukihiro Sakotsubo, Kohei Osawa, Shinya Sato, Teiji Shibasaki, Masahiro Yaegashi, Ryoichi Honma (Sandisk), Masayoshi Tagami, Katsuyuki Sekine (Kioxia) 		This paper introduces multi-stacked cell array CMOS directly bonded to array (MSA-CBA) technology for ultra-high-density... [more]
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