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Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 5 of 5  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
IST 2018-09-25
15:20
Tokyo Kikai-Shinko-Kaikan Bldg. Backside illuminated, three dimensional stacked single photon avalanche diode technology in 45nm CMOS
Yuichiro Yamashita (TSMC), Myung-Jae Lee (EPFL), Augusto Ronchini Ximenes (TUDelft), Preethi Padmanabhan (EPFL), Tzu-Jui Wang,, Kuo-Chin Huang,, Dun-Nian Yaung (TSMC), Edoardo Charbon (EPFL)
 [more] IST2018-51
pp.17-20
IST 2016-11-17
16:30
Tokyo TITECH Tamachi Campus [Poster Presentation] Poster, A Dedicated Image Processing Engine Stacked with CMOS Image Array at 40nm CMOS Imager Technologies
Biay-Cheng Hseih, Khoi Le, Keith Honea, Sergio Goma (QCOM), RJ Lin, Chin-Hao Chang, Kuo-Yu Chou, Calvin Chao (TSMC), Sami Khawam, Hasib Siddiqui (QCOM)
 [more] IST2016-50
pp.5-6
IST 2016-03-11
11:40
Tokyo NHK Research Lab (Setagaya) A 1.1μm 33Mpixel 240fps 3D-Stacked CMOS Image Sensor with 3-Stage Cyclic-Based Analog-to-Digital Converters
Toshiki Arai, Toshio Yasue, Kazuya Kitamura, Hiroshi Shimamoto (NHK STRL), Tomohiko Kosugi, Sungwook Jun, Satoshi Aoyama (Brookman Technology), Ming-Chieh Hsu, Yuichiro Yamashita (TSMC), Hirofumi Sumi (The University of Tokyo), Shoji Kawahito (Shizuoka University)
A 1.1μm 33Mpixel 240fps 3D-stacked CMOS image sensor with 3-stage cyclic-based ADC has been developed. The hybrid-stacki... [more] IST2016-12
pp.21-24
IST 2015-09-18
10:45
Tokyo Kikai-Shinko-Kaikan Bldg. The source decomposition of Dark FPN and its improvement by Stacked CIS process
Yuichiro Yamashita, Wen-hau Wu, Wen-jen Chiang, Chi-hsien Chung, Ren-jie Lin, Jhy-jyi Sze, Jen-cheng Liu, Cheng-hsien Tseng, Hirohumi Sumi (TSMC), Sho-gwo Wuu
 [more] IST2015-46
pp.13-15
IST 2014-09-29
13:30
Tokyo Kikai-Shinko-Kaikan Bldg. Advanced 1.1um Pixel CMOS Image Sensor with 3D Stacked Architecture
J. C. Liu, D. N. Yaung, J. J. Sze, C. C. Wang, G. Hung, C. J. Wang, T. H. Hsu, T. J. Wang, W. D. Wang, H. Y. Cheng, J. S. Lin, S. J. Tsai, Y. P. Chao, S. G. Wuu, Y. Yamashita (TSMC)
 [more] IST2014-40
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