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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
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IEICE-ICD, IEICE-SDM, IST [detail] |
2022-08-08 15:05 |
Online |
On-line |
Evaluation of Backside Voltage Disturbance Impacts and IC Chip Response in Flip Chip Packaging Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) |
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