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| Search Results: Conference Papers |
| Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| IST |
2018-09-25
15:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Backside illuminated, three dimensional stacked single photon avalanche diode technology in 45nm CMOS
Yuichiro Yamashita (TSMC), Myung-Jae Lee (EPFL), Augusto Ronchini Ximenes (TUDelft), Preethi Padmanabhan (EPFL), Tzu-Jui Wang,, Kuo-Chin Huang,, Dun-Nian Yaung (TSMC), Edoardo Charbon (EPFL) |
[more] |
IST2018-51
pp.17-20 |
| IST |
2016-03-11
11:40 |
Tokyo |
NHK Research Lab (Setagaya) |
A 1.1μm 33Mpixel 240fps 3D-Stacked CMOS Image Sensor with 3-Stage Cyclic-Based Analog-to-Digital Converters
Toshiki Arai, Toshio Yasue, Kazuya Kitamura, Hiroshi Shimamoto (NHK STRL), Tomohiko Kosugi, Sungwook Jun, Satoshi Aoyama (Brookman Technology), Ming-Chieh Hsu, Yuichiro Yamashita (TSMC), Hirofumi Sumi (The University of Tokyo), Shoji Kawahito (Shizuoka University) |
A 1.1μm 33Mpixel 240fps 3D-stacked CMOS image sensor with 3-stage cyclic-based ADC has been developed. The hybrid-stacki... [more] |
IST2016-12
pp.21-24 |
| IST |
2015-09-18
10:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The source decomposition of Dark FPN and its improvement by Stacked CIS process
Yuichiro Yamashita, Wen-hau Wu, Wen-jen Chiang, Chi-hsien Chung, Ren-jie Lin, Jhy-jyi Sze, Jen-cheng Liu, Cheng-hsien Tseng, Hirohumi Sumi (TSMC), Sho-gwo Wuu |
[more] |
IST2015-46
pp.13-15 |
| IST, CE |
2011-05-13
15:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
A 300mm Wafer-size CMOS Image Sensor
Yasuhiro Oguro, Hidekazu Takahashi, Yuichiro Yamashita, Shin Kikuchi, Masato Fujita, Satoshi Hirayama, Taikan Kano, Sakae Hashimoto, Genzo Momma, Shunsuke Inoue (Canon) |
A 202×205 mm2, CMOS image sensor is fabricated on 300mm wafer in 0.25um 1P3M CMOS process. This sensor has 1.6M pixels, ... [more] |
IST2011-14 CE2011-20
pp.19-22 |
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