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| Search Results: Conference Papers |
| Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| IST |
2021-03-26
15:00 |
Tokyo |
Online |
[Invited Talk]
Evolving Image Sensor Architecture through Stacking Devices
Yusuke Oike (Sony) |
The evolution of CMOS image sensors and the prospects utilizing advanced imaging technologies promise to improve our qua... [more] |
IST2021-18
p.43 |
| IST, ME, IEICE-BioX [detail] |
2019-06-06
14:00 |
Ishikawa |
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Acquisition of high spatial resolution image by two-layer imaging using organic thin film and solid state senser
Goki Tsukimura (Tokyo Univ. of Science), Daisuke Sugimura (Tsuda Univ.), Takayuki Hamamoto (Tokyo Univ. of Science) |
In this paper, we propose an imaging system using a sensor, which organic image sensor and solid state sensor are stacke... [more] |
IST2019-25 ME2019-73
pp.9-12 |
| IST |
2016-03-11
09:45 |
Tokyo |
NHK Research Lab (Setagaya) |
Multi-storied photodiode CMOS image sensor for multiband imaging with 3D technology
Yoshiaki Takemoto, Kenji Kobayashi, Mitsuhiro Tsukimura, Naohiro Takazawa, Hideki Kato, Shunsuke Suzuki, Jun Aoki, Toru Kondo, Haruhisa Saito, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus) |
We demonstrated multiband imaging with a multi-storied photodiode CMOS image sensor (CIS), which comprises two individua... [more] |
IST2016-8
pp.5-8 |
| IST |
2016-03-11
11:40 |
Tokyo |
NHK Research Lab (Setagaya) |
A 1.1μm 33Mpixel 240fps 3D-Stacked CMOS Image Sensor with 3-Stage Cyclic-Based Analog-to-Digital Converters
Toshiki Arai, Toshio Yasue, Kazuya Kitamura, Hiroshi Shimamoto (NHK STRL), Tomohiko Kosugi, Sungwook Jun, Satoshi Aoyama (Brookman Technology), Ming-Chieh Hsu, Yuichiro Yamashita (TSMC), Hirofumi Sumi (The University of Tokyo), Shoji Kawahito (Shizuoka University) |
A 1.1μm 33Mpixel 240fps 3D-stacked CMOS image sensor with 3-stage cyclic-based ADC has been developed. The hybrid-stacki... [more] |
IST2016-12
pp.21-24 |
| IST |
2014-03-14
11:30 |
Tokyo |
NHK |
3D Stacked CMOS Image Sensor
Taku Umebayashi, Tomoharu Ogita, Shunichi Sukegawa, Tsutomu Nakajima, Hiroshi Kawanobe (Sony), Ken Koseki (Sony LSI Design), Tsutomu Haruta, Hiroshi Takahashi (Sony), Keishi Inoue (Sony Semiconductor), Toshifumi Wakano, Yusuke Mada, Koji Fukumoto, Takashi Nagano, Yoshikazu Nitta, Teruo Hirayama (Sony) |
We have developed 3D stacked CMOS image sensor. This technology is a Back-illuminated CIS stacking on a logic substrate.... [more] |
IST2014-9
p.5 |
| IEICE-MRIS, MMS |
2013-12-12
16:15 |
Ehime |
Ehime Univ. |
Deposition of Co/Pt film with perpendicular magnetic anisotropy by layer stacking sputtering
Taruho Tsuchiya, Naoki Honda (Tohoku Inst. Tech.) |
Low temperature preparation of Co/Pt stacked film with high magnetic anisotropy was studied using atomic layer stacking ... [more] |
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