| Paper Abstract and Keywords |
| Presentation |
2017-11-13 13:00
[Invited Talk]
A 1000fps High-Speed Vision Chip with 3D-Stacked 140GOPS Column-Parallel PEs and its Applications
Shinichi Yoshimura, Tomohiro Yamazaki, Hironobu Katayama, Shuji Uehara, Atsushi Nose, Masatsugu Kobayashi, Sayaka Shida, Takashi Izawa, Yoshinori Muramatsu (Sony Semiconductor Solutions Co.), Masaki Odahara, Kenichi Takamiya, Yasuaki Hisamatsu, Shizunori Matsumoto (Sony LSI Design Inc.), Leo Miyashita, Yoshihiro Watanabe, Masatoshi Ishikawa (University of Tokyo) |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
A 1/3.2-inch 1.27Mpixel 500fps (0.31Mpixel 1000fps at 2×2 binning mode) vision chip with 3D-stacked CMOS image sensor has been developed. This sensor achieves high resolution and high sensitivity by back-illuminated stacked pixels. The sensor also achieves high speed inter-pixel and inter-frame processing by two kinds of column-parallel processing elements. With these technologies, it is possible to provide visual feedback to the control device with an accuracy of 1ms that cannot be identified by human eyes. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
Column-Parallel process units / visual feedback / 3D-stacked CMOS image sensor / high speed vision chip / 1000fps / / / |
| Reference Info. |
ITE Tech. Rep., vol. 41, no. 37, IST2017-60, pp. 1-4, Nov. 2017. |
| Paper # |
IST2017-60 |
| Date of Issue |
2017-11-06 (IST) |
| ISSN |
Print edition: ISSN 1342-6893 Online edition: ISSN 2424-1970 |
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