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Paper Abstract and Keywords
Presentation 2019-09-20 13:15
Digital Pixel Image Sensors with Linear and Wide-Dynamic-Range Output Developed by Pixel-Wise 3-D Integration
Masahide Goto (NHK), Yuki Honda (NHK-ES), Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo)
Abstract (in Japanese) (See Japanese page) 
(in English) We report digital pixel image sensors developed by using pixel-wise three-dimensional (3D) integration technology. Photodiodes (PDs), pulse generation circuits and 16-bit pulse counters are three-dimensionally integrated within every pixel by direct bonding of silicon on insulator (SOI) layers with embedded Au electrodes, which provides in-pixel pulse frequency modulation A/D converters. The developed sensor successfully confirms excellent linearity with a dynamic range of 96 dB, corresponding to a 16-bit value. Pixel-parallel video images with QVGA resolution (320 × 240 pixels) without pixel defects are obtained, demonstrating the feasibility of ultimate image sensors for the next-generation.
Keyword (in Japanese) (See Japanese page) 
(in English) CMOS image sensor / 3D integration / bonding / SOI / photodiode / A/D converter / /  
Reference Info. ITE Tech. Rep., vol. 43, no. 31, IST2019-47, pp. 17-20, Sept. 2019.
Paper # IST2019-47 
Date of Issue 2019-09-13 (IST) 
ISSN Print edition: ISSN 1342-6893  Online edition: ISSN 2424-1970
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Conference Information
Committee IST  
Conference Date 2019-09-20 - 2019-09-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Image Sensor , etc. 
Paper Information
Registration To IST 
Conference Code 2019-09-IST 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Digital Pixel Image Sensors with Linear and Wide-Dynamic-Range Output Developed by Pixel-Wise 3-D Integration 
Sub Title (in English)  
Keyword(1) CMOS image sensor  
Keyword(2) 3D integration  
Keyword(3) bonding  
Keyword(4) SOI  
Keyword(5) photodiode  
Keyword(6) A/D converter  
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Keyword(8)  
1st Author's Name Masahide Goto  
1st Author's Affiliation NHK Science and Technology Research Laboratories (NHK)
2nd Author's Name Yuki Honda  
2nd Author's Affiliation NHK Engineering System (NHK-ES)
3rd Author's Name Toshihisa Watabe  
3rd Author's Affiliation NHK Science and Technology Research Laboratories (NHK)
4th Author's Name Kei Hagiwara  
4th Author's Affiliation NHK Science and Technology Research Laboratories (NHK)
5th Author's Name Masakazu Nanba  
5th Author's Affiliation NHK Science and Technology Research Laboratories (NHK)
6th Author's Name Yoshinori Iguchi  
6th Author's Affiliation NHK Science and Technology Research Laboratories (NHK)
7th Author's Name Takuya Saraya  
7th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
8th Author's Name Masaharu Kobayashi  
8th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
9th Author's Name Eiji Higurashi  
9th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
10th Author's Name Hiroshi Toshiyoshi  
10th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
11th Author's Name Toshiro Hiramoto  
11th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
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Speaker
Date Time 2019-09-20 13:15:00 
Presentation Time 30 
Registration for IST 
Paper # ITE-IST2019-47 
Volume (vol) ITE-43 
Number (no) no.31 
Page pp.17-20 
#Pages ITE-4 
Date of Issue ITE-IST-2019-09-13 


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