| Paper Abstract and Keywords |
| Presentation |
2013-09-30 16:00
[Special Talk]
Silicon photonics for high-density optical interconnects and telecom applications
Koji Yamada (NTT) |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
Silicon (Si) photonics technology, which has a DNA of Si electronics technology, would provide a promising photonics-electronics integration platform with superior mass-productivity and cost performance. Using this technology, various photonic devices, such as filters, modulators and detectors, have been developed and are now monolithically integrated on a Si chip. Moreover, photonics-electronics convergence is now being developed intensively. Ultra-compact photonics-electronics module based on this technology would significantly contribute to the construction of energy-efficient, cost-effective information trading systems. Considering material characteristics of Si and present fabrication technology, however, these advantages show trade-off relation to device performances. In this paper, at first, we review the present status of Si photonics technology, and reveal its pros and cons. Then, we discuss about technological obstacles to the practical applications of Si photonics as a multi-purpose photonic integration platform. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
Silicon photonics / photonic integration / photonics electronics convergence / optical interconnects / optical telecommunications / / / |
| Reference Info. |
ITE Tech. Rep., vol. 37, no. 40, IST2013-50, pp. 29-36, Sept. 2013. |
| Paper # |
IST2013-50 |
| Date of Issue |
2013-09-23 (IST) |
| ISSN |
Print edition: ISSN 1342-6893 |
| Download PDF |
|
| Conference Information |
| Committee |
IST |
| Conference Date |
2013-09-30 - 2013-09-30 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
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| Paper Information |
| Registration To |
IST |
| Conference Code |
2013-09-IST |
| Language |
English (Japanese title is available) |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
Silicon photonics for high-density optical interconnects and telecom applications |
| Sub Title (in English) |
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| Keyword(1) |
Silicon photonics |
| Keyword(2) |
photonic integration |
| Keyword(3) |
photonics electronics convergence |
| Keyword(4) |
optical interconnects |
| Keyword(5) |
optical telecommunications |
| Keyword(6) |
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| Keyword(7) |
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| 1st Author's Name |
Koji Yamada |
| 1st Author's Affiliation |
Nippon Telegraph and Telephone Corporation (NTT) |
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| Speaker |
Author-1 |
| Date Time |
2013-09-30 16:00:00 |
| Presentation Time |
20 minutes |
| Registration for |
IST |
| Paper # |
IST2013-50 |
| Volume (vol) |
vol.37 |
| Number (no) |
no.40 |
| Page |
pp.29-36 |
| #Pages |
8 |
| Date of Issue |
2013-09-23 (IST) |
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