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Paper Abstract and Keywords
Presentation 2013-09-30 16:00
[Special Talk] Silicon photonics for high-density optical interconnects and telecom applications
Koji Yamada (NTT)
Abstract (in Japanese) (See Japanese page) 
(in English) Silicon (Si) photonics technology, which has a DNA of Si electronics technology, would provide a promising photonics-electronics integration platform with superior mass-productivity and cost performance. Using this technology, various photonic devices, such as filters, modulators and detectors, have been developed and are now monolithically integrated on a Si chip. Moreover, photonics-electronics convergence is now being developed intensively. Ultra-compact photonics-electronics module based on this technology would significantly contribute to the construction of energy-efficient, cost-effective information trading systems. Considering material characteristics of Si and present fabrication technology, however, these advantages show trade-off relation to device performances. In this paper, at first, we review the present status of Si photonics technology, and reveal its pros and cons. Then, we discuss about technological obstacles to the practical applications of Si photonics as a multi-purpose photonic integration platform.
Keyword (in Japanese) (See Japanese page) 
(in English) Silicon photonics / photonic integration / photonics electronics convergence / optical interconnects / optical telecommunications / / /  
Reference Info. ITE Tech. Rep., vol. 37, no. 40, IST2013-50, pp. 29-36, Sept. 2013.
Paper # IST2013-50 
Date of Issue 2013-09-23 (IST) 
ISSN Print edition: ISSN 1342-6893  Online edition: ISSN 2424-1970
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Conference Information
Committee IST  
Conference Date 2013-09-30 - 2013-09-30 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To IST 
Conference Code 2013-09-IST 
Language English (Japanese title is available) 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Silicon photonics for high-density optical interconnects and telecom applications 
Sub Title (in English)  
Keyword(1) Silicon photonics  
Keyword(2) photonic integration  
Keyword(3) photonics electronics convergence  
Keyword(4) optical interconnects  
Keyword(5) optical telecommunications  
1st Author's Name Koji Yamada  
1st Author's Affiliation Nippon Telegraph and Telephone Corporation (NTT)
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Date Time 2013-09-30 16:00:00 
Presentation Time 20 
Registration for IST 
Paper # ITE-IST2013-50 
Volume (vol) ITE-37 
Number (no) no.40 
Page pp.29-36 
#Pages ITE-8 
Date of Issue ITE-IST-2013-09-23 

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