ITE Technical Group Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2015-09-18 10:15
A 3D stacked CMOS image sensor with 16Mpixel global-shutter mode using 4 million interconnections
Toru Kondo, Yoshiaki Takemoto, Kenji Kobayashi, Mitsuhiro Tsukimura, Naohiro Takazawa, Hideki Kato, Shunsuke Suzuki, Jun Aoki, Haruhisa Saito, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus)
Abstract (in Japanese) (See Japanese page) 
(in English) We have developed a 16Mpixel 3D stacked global-shutter CMOS image sensor with pixel level interconnections using 4 million micro bumps. The four photodiodes in the unit pixel circuit on the top substrate share one micro-bump interconnection in 7.6µm pitch. Each signal of the photodiodes is transferred to the corresponding storage node on the bottom substrate via the interconnection to achieve a global shutter function. The ratio of the parasitic light sensitivity of an in-pixel storage node and the light sensitivity of a photodiode is -180dB with 3.8µm pixel size.
Keyword (in Japanese) (See Japanese page) 
(in English) CMOS Image Sensor / 3D stacked structure / Global shutter / In-Pixel Storage Node / / / /  
Reference Info. ITE Tech. Rep., vol. 39, no. 35, IST2015-45, pp. 9-12, Sept. 2015.
Paper # IST2015-45 
Date of Issue 2015-09-11 (IST) 
ISSN Print edition: ISSN 1342-6893    Online edition: ISSN 2424-1970
Download PDF

Conference Information
Committee IST  
Conference Date 2015-09-18 - 2015-09-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To IST 
Conference Code 2015-09-IST 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A 3D stacked CMOS image sensor with 16Mpixel global-shutter mode using 4 million interconnections 
Sub Title (in English)  
Keyword(1) CMOS Image Sensor  
Keyword(2) 3D stacked structure  
Keyword(3) Global shutter  
Keyword(4) In-Pixel Storage Node  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Toru Kondo  
1st Author's Affiliation Olympus Corp. (Olympus)
2nd Author's Name Yoshiaki Takemoto  
2nd Author's Affiliation Olympus Corp. (Olympus)
3rd Author's Name Kenji Kobayashi  
3rd Author's Affiliation Olympus Corp. (Olympus)
4th Author's Name Mitsuhiro Tsukimura  
4th Author's Affiliation Olympus Corp. (Olympus)
5th Author's Name Naohiro Takazawa  
5th Author's Affiliation Olympus Corp. (Olympus)
6th Author's Name Hideki Kato  
6th Author's Affiliation Olympus Corp. (Olympus)
7th Author's Name Shunsuke Suzuki  
7th Author's Affiliation Olympus Corp. (Olympus)
8th Author's Name Jun Aoki  
8th Author's Affiliation Olympus Corp. (Olympus)
9th Author's Name Haruhisa Saito  
9th Author's Affiliation Olympus Corp. (Olympus)
10th Author's Name Yuichi Gomi  
10th Author's Affiliation Olympus Corp. (Olympus)
11th Author's Name Seisuke Matsuda  
11th Author's Affiliation Olympus Corp. (Olympus)
12th Author's Name Yoshitaka Tadaki  
12th Author's Affiliation Olympus Corp. (Olympus)
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2015-09-18 10:15:00 
Presentation Time 30 minutes 
Registration for IST 
Paper # IST2015-45 
Volume (vol) vol.39 
Number (no) no.35 
Page pp.9-12 
#Pages 4 
Date of Issue 2015-09-11 (IST) 

[Return to Top Page]

[Return to ITE Web Page]
The Institute of Image Information and Television Engineers (ITE), Japan