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Paper Abstract and Keywords
Presentation 2017-02-24 14:55
[Invited Talk] Cutting Method for Electronic Device Made Using Ultrathin Glass
Naotoshi Inayama, Shinkichi Miwa, Takahide Fujii (NEG)
Abstract (in Japanese) (See Japanese page) 
(in English) The simultaneous laser thermal stress cutting method (SLTSC) has been newly developed as cutting methods for an electronic device made using ultrathin glass. Compared with other methods, the novel cutting method is one path cutting of the display to achieve high bending strength due to high quality edge.
Keyword (in Japanese) (See Japanese page) 
(in English) Ultrathin glass / Device cutting / Laser thermal stress cutting / / / / /  
Reference Info. ITE Tech. Rep., vol. 41, no. 7, IDY2017-21, pp. 15-18, Feb. 2017.
Paper # IDY2017-21 
Date of Issue 2017-02-17 (IDY) 
ISSN Print edition: ISSN 1342-6893    Online edition: ISSN 2424-1970
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Conference Information
Committee IDY  
Conference Date 2017-02-24 - 2017-02-24 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To IDY 
Conference Code 2017-02-IDY 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Cutting Method for Electronic Device Made Using Ultrathin Glass 
Sub Title (in English)  
Keyword(1) Ultrathin glass  
Keyword(2) Device cutting  
Keyword(3) Laser thermal stress cutting  
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1st Author's Name Naotoshi Inayama  
1st Author's Affiliation Nippon Electric Glass Co.,Ltd. (NEG)
2nd Author's Name Shinkichi Miwa  
2nd Author's Affiliation Nippon Electric Glass Co.,Ltd. (NEG)
3rd Author's Name Takahide Fujii  
3rd Author's Affiliation Nippon Electric Glass Co.,Ltd. (NEG)
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Speaker Author-1 
Date Time 2017-02-24 14:55:00 
Presentation Time 30 minutes 
Registration for IDY 
Paper # IDY2017-21 
Volume (vol) vol.41 
Number (no) no.7 
Page pp.15-18 
#Pages
Date of Issue 2017-02-17 (IDY) 


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