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Paper Abstract and Keywords
Presentation 2020-03-27 13:30
High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer
Shunsuke Maruyama, Shuji Manda, Ryosuke Matsumoto, Suguru Saito, Hideki Minari, Takaaki Hirano, Taizo Takachi, Nobutoshi Fujii, Yuichi Yamamoto, Yoshifumi Zaizen, Tomoyuki Hirano, Hayato Iwamoto (SSS)
Abstract (in Japanese) (See Japanese page) 
(in English) We developed a back-illuminated InGaAs image sensor with 1280x1024 pixels at 5-um pitch by using Cu-Cu hybridization connecting different materials, a III-V InGaAs/InP of photodiode array (PDA), and a silicon readout integrated circuit (ROIC). A new process architecture using an InGaAs/InP dies-to-silicon wafer and Cu-Cu bonding was established for high productivity and pixel-pitch scaling. We achieved low dark current and high sensitivity for wavelengths ranging from visible to short-wavelength infrared (SWIR).
Keyword (in Japanese) (See Japanese page) 
(in English) SWIR Image Sensor / InGaAs / Cu-Cu Bonding / / / / /  
Reference Info. ITE Tech. Rep., vol. 44, no. 11, IST2020-16, pp. 35-39, March 2020.
Paper # IST2020-16 
Date of Issue 2020-03-20 (IST) 
ISSN Print edition: ISSN 1342-6893  Online edition: ISSN 2424-1970
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Conference Information
Committee IST  
Conference Date 2020-03-27 - 2020-03-27 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikaishinko kaikan 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Image Sensors, etc. 
Paper Information
Registration To IST 
Conference Code 2020-03-IST 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer 
Sub Title (in English)  
Keyword(1) SWIR Image Sensor  
Keyword(2) InGaAs  
Keyword(3) Cu-Cu Bonding  
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1st Author's Name Shunsuke Maruyama  
1st Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
2nd Author's Name Shuji Manda  
2nd Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
3rd Author's Name Ryosuke Matsumoto  
3rd Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
4th Author's Name Suguru Saito  
4th Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
5th Author's Name Hideki Minari  
5th Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
6th Author's Name Takaaki Hirano  
6th Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
7th Author's Name Taizo Takachi  
7th Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
8th Author's Name Nobutoshi Fujii  
8th Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
9th Author's Name Yuichi Yamamoto  
9th Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
10th Author's Name Yoshifumi Zaizen  
10th Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
11th Author's Name Tomoyuki Hirano  
11th Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
12th Author's Name Hayato Iwamoto  
12th Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
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Speaker
Date Time 2020-03-27 13:30:00 
Presentation Time 25 
Registration for IST 
Paper # ITE-IST2020-16 
Volume (vol) ITE-44 
Number (no) no.11 
Page pp.35-39 
#Pages ITE-5 
Date of Issue ITE-IST-2020-03-20 


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