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Paper Abstract and Keywords
Presentation 2021-03-26 12:50
A Back Illuminated 10μm SPAD Pixel Array Comprising Full Trench Isolation and Cu-Cu Bonding with Over 14% PDE at 940nm
Kyosuke Ito, Yusuke Otake, Yoshiaki Kitano, Akira Matsumoto, Junpei Yamamoto, Takayuki Ogasahara, Hiroki Hiyama, Ryusei Naito, Kohei Takeuchi, Takanori Tada, Kosaku Takabayashi, Hajime Nakayama, Keiji Tatani, Tomoyuki Hirano, Toshifumi Wakano (SONY)
Abstract (in Japanese) (See Japanese page) 
(in English) A state of the art Back Illuminated (BI) Single Photon Avalanche Diode (SPAD) array sensor realized via a 90nm CMOS process on a 300 mm silicon platform is reported in the following. The array consists of 10 μm pixels, each using a 7μm thick silicon active layer, which allows to extend the device’s optical sensitivity up to the Near-Infrared (NIR) spectrum. Furthermore, buried metal Full Trench Isolation (FTI) was employed to suppress crosstalk (X-talk) by a neighboring pixel. Finally, in order to maximize the Fill Factor (F.F), a Cu-Cu bonding process was carried out. Through process and device design optimization, not only a Photon Detection Efficiency (PDE) greater than 14% at λ= 940nm and low timing jitter were achieved, but also the best in class Dark Count Rate (DCR) as compared to previously reported SPAD sensors. These combined features pave the way towards efficient, eye-safe and cost-effective time of flight applications.
Keyword (in Japanese) (See Japanese page) 
(in English) SPAD / Time-of-Flight / Depth Sensor / dToF / Back Illuminated / / /  
Reference Info. ITE Tech. Rep., vol. 45, no. 11, IST2021-14, pp. 25-28, March 2021.
Paper # IST2021-14 
Date of Issue 2021-03-19 (IST) 
ISSN Print edition: ISSN 1342-6893  Online edition: ISSN 2424-1970
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Conference Information
Committee IST  
Conference Date 2021-03-26 - 2021-03-26 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Image Sensors, etc. 
Paper Information
Registration To IST 
Conference Code 2021-03-IST 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Back Illuminated 10μm SPAD Pixel Array Comprising Full Trench Isolation and Cu-Cu Bonding with Over 14% PDE at 940nm 
Sub Title (in English)  
Keyword(1) SPAD  
Keyword(2) Time-of-Flight  
Keyword(3) Depth Sensor  
Keyword(4) dToF  
Keyword(5) Back Illuminated  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Kyosuke Ito  
1st Author's Affiliation Sony Semiconductor Solutions (SONY)
2nd Author's Name Yusuke Otake  
2nd Author's Affiliation Sony Semiconductor Solutions (SONY)
3rd Author's Name Yoshiaki Kitano  
3rd Author's Affiliation Sony Semiconductor Solutions (SONY)
4th Author's Name Akira Matsumoto  
4th Author's Affiliation Sony Semiconductor Solutions (SONY)
5th Author's Name Junpei Yamamoto  
5th Author's Affiliation Sony Semiconductor Solutions (SONY)
6th Author's Name Takayuki Ogasahara  
6th Author's Affiliation Sony Semiconductor Solutions (SONY)
7th Author's Name Hiroki Hiyama  
7th Author's Affiliation Sony Semiconductor Solutions (SONY)
8th Author's Name Ryusei Naito  
8th Author's Affiliation Sony Semiconductor Manufacturing (SONY)
9th Author's Name Kohei Takeuchi  
9th Author's Affiliation Sony Semiconductor Manufacturing (SONY)
10th Author's Name Takanori Tada  
10th Author's Affiliation Sony Semiconductor Manufacturing (SONY)
11th Author's Name Kosaku Takabayashi  
11th Author's Affiliation Sony Semiconductor Manufacturing (SONY)
12th Author's Name Hajime Nakayama  
12th Author's Affiliation Sony Semiconductor Manufacturing (SONY)
13th Author's Name Keiji Tatani  
13th Author's Affiliation Sony Semiconductor Solutions (SONY)
14th Author's Name Tomoyuki Hirano  
14th Author's Affiliation Sony Semiconductor Solutions (SONY)
15th Author's Name Toshifumi Wakano  
15th Author's Affiliation Sony Semiconductor Solutions (SONY)
16th Author's Name  
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17th Author's Affiliation ()
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18th Author's Affiliation ()
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Speaker
Date Time 2021-03-26 12:50:00 
Presentation Time 25 
Registration for IST 
Paper # ITE-IST2021-14 
Volume (vol) ITE-45 
Number (no) no.11 
Page pp.25-28 
#Pages ITE-4 
Date of Issue ITE-IST-2021-03-19 


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