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Paper Abstract and Keywords
Presentation 2022-03-28 11:10
Charge Transfer Analysis for Vertical Transfer Gates by 3D Device Simulation and Its Application for High-Speed Image Sensors
Hideki Mutoh (Link Research)
Abstract (in Japanese) (See Japanese page) 
(in English) The analysis of charge transfer characteristics for CMOS image sensors with vertical transfer gates by 3D device simulation is reported. The 3D device simulator SPECTRA was improved to treat oblique boundary of different materials before the analysis. It was found that it is effective for high charge transfer efficiency to fabricate the floating diffusion at the same depth as the maximum potential point of the photodiode. It is expected to realize an ultra-high speed image sensor with high sensitivity and high resolution by reducing the pixel size and arranging plural vertical transfer gates and floating diffusions around a photodiode.
Keyword (in Japanese) (See Japanese page) 
(in English) Vertical Transfer Gate / High-Speed Image Sensor / Device Simulation / VTG / / / /  
Reference Info. ITE Tech. Rep., vol. 46, no. 14, IST2022-14, pp. 17-20, March 2022.
Paper # IST2022-14 
Date of Issue 2022-03-21 (IST) 
ISSN Print edition: ISSN 1342-6893    Online edition: ISSN 2424-1970
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Conference Information
Committee IST  
Conference Date 2022-03-28 - 2022-03-28 
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Paper Information
Registration To IST 
Conference Code 2022-03-IST 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Charge Transfer Analysis for Vertical Transfer Gates by 3D Device Simulation and Its Application for High-Speed Image Sensors 
Sub Title (in English)  
Keyword(1) Vertical Transfer Gate  
Keyword(2) High-Speed Image Sensor  
Keyword(3) Device Simulation  
Keyword(4) VTG  
1st Author's Name Hideki Mutoh  
1st Author's Affiliation Link Research Corporation (Link Research)
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Speaker Author-1 
Date Time 2022-03-28 11:10:00 
Presentation Time 25 minutes 
Registration for IST 
Paper # IST2022-14 
Volume (vol) vol.46 
Number (no) no.14 
Page pp.17-20 
Date of Issue 2022-03-21 (IST) 

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