| Conference Information |
| Committee |
IEICE-ICD IEICE-SDM IST |
| Conference Date |
2022-08-08 - 2022-08-10 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
On-line |
| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
Analog, Mixed Analog and Digital, RF, and Sensor Interface, Low Voltage/Low Power Techniques, Novel Devices/Circuits, and the Applications |
| Paper Information |
| Registration To |
IEICE-ICD |
| Conference Code |
2022-08-ICD-SDM-IST |
| Language |
Japanese |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
Evaluation of Backside Voltage Disturbance Impacts and IC Chip Response in Flip Chip Packaging |
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| 1st Author's Name |
Takuya Wadatsumi |
| 1st Author's Affiliation |
Kobe University (Kobe Univ.) |
| 2nd Author's Name |
Kohei Kawai |
| 2nd Author's Affiliation |
Kobe University (Kobe Univ.) |
| 3rd Author's Name |
Rikuu Hasegawa |
| 3rd Author's Affiliation |
Kobe University (Kobe Univ.) |
| 4th Author's Name |
Kikuo Muramatsu |
| 4th Author's Affiliation |
e-SYNC Co., Ltd. (e-SYNC) |
| 5th Author's Name |
Hiromu Hasegawa |
| 5th Author's Affiliation |
MegaChips Corp. (Megachips) |
| 6th Author's Name |
Takuya Sawada |
| 6th Author's Affiliation |
MegaChips Corp. (Megachips) |
| 7th Author's Name |
Takahito Fukushima |
| 7th Author's Affiliation |
MegaChips Corp. (Megachips) |
| 8th Author's Name |
Hisashi Kondo |
| 8th Author's Affiliation |
MegaChips Corp. (Megachips) |
| 9th Author's Name |
Takuji Miki |
| 9th Author's Affiliation |
Kobe University (Kobe Univ.) |
| 10th Author's Name |
Makoto Nagata |
| 10th Author's Affiliation |
Kobe University (Kobe Univ.) |
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| Speaker |
Author-1 |
| Date Time |
2022-08-08 15:05:00 |
| Presentation Time |
25 minutes |
| Registration for |
IEICE-ICD |
| Paper # |
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| Volume (vol) |
vol.46 |
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