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Paper Abstract and Keywords
Presentation 2026-08-06 10:00
[Invited Talk] A Multi-Stacked Cell Array Architecture with Wafer-to-Wafer Cu Direct Bonding for Ultra-High-Density 3D Flash Memory beyond 1,000 Word Lines
Mitsuhiko Noda, Susumu Hashimoto, Ryuta Mizumoto, Mamoru Watanabe, Genki Sawada, Kanta Kawasaki, Masahisa Sonoda, Eiji Kamiya, Tetsu Morooka, Keisuke Nakatsuka, Hiroshi Maejima, Shigeki Kobayashi, Shinji Suzuki (Kioxia), Yukihiro Sakotsubo, Kohei Osawa, Shinya Sato, Teiji Shibasaki, Masahiro Yaegashi, Ryoichi Honma (Sandisk), Masayoshi Tagami, Katsuyuki Sekine (Kioxia)
Abstract (in Japanese) (See Japanese page) 
(in English) (Available after conference date)
Keyword (in Japanese) (See Japanese page) 
(in English) 3D Flash Memory / MSA-CBA / Wafer-to-Wafer Cu Direct Bonding / QLC / / / /  
Reference Info. ITE Tech. Rep.
Paper #  
Date of Issue  
ISSN Online edition: ISSN 2424-1970
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Conference Information
Committee IEICE-ICD IEICE-SDM IST  
Conference Date 2026-08-04 - 2026-08-06 
Place (in Japanese) (See Japanese page) 
Place (in English) Hokkaido Univ, Pharmaceutical Sciences, Lecture Room 2 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Analog, Mixed Analog and Digital, RF, and Sensor Interface, Low Voltage/Low Power Techniques, Novel Devices/Circuits, and the Applications 
Paper Information
Registration To IEICE-SDM 
Conference Code 2026-08-ICD-SDM-IST 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Multi-Stacked Cell Array Architecture with Wafer-to-Wafer Cu Direct Bonding for Ultra-High-Density 3D Flash Memory beyond 1,000 Word Lines 
Sub Title (in English) * 
Keyword(1) 3D Flash Memory  
Keyword(2) MSA-CBA  
Keyword(3) Wafer-to-Wafer Cu Direct Bonding  
Keyword(4) QLC  
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1st Author's Name Mitsuhiko Noda  
1st Author's Affiliation Kioxia Corporation (Kioxia)
2nd Author's Name Susumu Hashimoto  
2nd Author's Affiliation Kioxia Corporation (Kioxia)
3rd Author's Name Ryuta Mizumoto  
3rd Author's Affiliation Kioxia Corporation (Kioxia)
4th Author's Name Mamoru Watanabe  
4th Author's Affiliation Kioxia Corporation (Kioxia)
5th Author's Name Genki Sawada  
5th Author's Affiliation Kioxia Corporation (Kioxia)
6th Author's Name Kanta Kawasaki  
6th Author's Affiliation Kioxia Corporation (Kioxia)
7th Author's Name Masahisa Sonoda  
7th Author's Affiliation Kioxia Corporation (Kioxia)
8th Author's Name Eiji Kamiya  
8th Author's Affiliation Kioxia Corporation (Kioxia)
9th Author's Name Tetsu Morooka  
9th Author's Affiliation Kioxia Corporation (Kioxia)
10th Author's Name Keisuke Nakatsuka  
10th Author's Affiliation Kioxia Corporation (Kioxia)
11th Author's Name Hiroshi Maejima  
11th Author's Affiliation Kioxia Corporation (Kioxia)
12th Author's Name Shigeki Kobayashi  
12th Author's Affiliation Kioxia Corporation (Kioxia)
13th Author's Name Shinji Suzuki  
13th Author's Affiliation Kioxia Corporation (Kioxia)
14th Author's Name Yukihiro Sakotsubo  
14th Author's Affiliation Sandisk Corporation (Sandisk)
15th Author's Name Kohei Osawa  
15th Author's Affiliation Sandisk Corporation (Sandisk)
16th Author's Name Shinya Sato  
16th Author's Affiliation Sandisk Corporation (Sandisk)
17th Author's Name Teiji Shibasaki  
17th Author's Affiliation Sandisk Corporation (Sandisk)
18th Author's Name Masahiro Yaegashi  
18th Author's Affiliation Sandisk Corporation (Sandisk)
19th Author's Name Ryoichi Honma  
19th Author's Affiliation Sandisk Corporation (Sandisk)
20th Author's Name Masayoshi Tagami  
20th Author's Affiliation Kioxia Corporation (Kioxia)
21st Author's Name Katsuyuki Sekine  
21st Author's Affiliation Kioxia Corporation (Kioxia)
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Speaker Author-1 
Date Time 2026-08-06 10:00:00 
Presentation Time 45 minutes 
Registration for IEICE-SDM 
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