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Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
IEICE-ICD, IEICE-SDM, IST [detail] |
2024-08-06 15:00 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
Evaluation and analysis of thermal characteristics near the chip in 3D stacked chips Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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IEICE-ICD, IEICE-SDM, IST [detail] |
2022-08-08 15:05 |
Online |
On-line |
Evaluation of Backside Voltage Disturbance Impacts and IC Chip Response in Flip Chip Packaging Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) |
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