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All Technical Committee Conferences (Searched in: Recent 10 Years)
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| Search Results: Conference Papers |
| Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| IEICE-ICD, IEICE-SDM, IST [detail] |
2024-08-06
15:00 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
Evaluation and analysis of thermal characteristics near the chip in 3D stacked chips
Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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| IEICE-ICD, IEICE-SDM, IST [detail] |
2023-08-01
10:45 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
A research on a cryogenic ADC for acquisition of environmental noise near quantum devices.
Tomoya Yamada, Ryozo Takahashi, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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| IEICE-ICD, IEICE-SDM, IST [detail] |
2023-08-01
11:10 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
Evaluation on Flip-Chip Packaging for Quantum Computers at Cryogenic Temperature
Misato Taguchi, Ryozo Takahashi, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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| IEICE-ICD, IEICE-SDM, IST [detail] |
2022-08-08
15:05 |
Online |
On-line |
Evaluation of Backside Voltage Disturbance Impacts and IC Chip Response in Flip Chip Packaging
Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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| IEICE-ICD, IEICE-SDM, IST [detail] |
2022-08-08
15:55 |
Online |
On-line |
A cryogenic digital-to-analog converter for high-fidelity control of large-scale qubit arrays
Ryozo Takahashi, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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| IEICE-SDM, IEICE-ICD, IST [detail] |
2021-08-18
15:35 |
Online |
Online |
On-chip multi-channel noise sensor circuits to detect off-chip security attacks
Ryozo Takahashi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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| IEICE-ICD, IEICE-SDM, IST [detail] |
2020-08-06
13:50 |
Online |
Online |
Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance
Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) |
[more] |
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