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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
IST 2020-03-27
17:00
Tokyo Kikaishinko kaikan
(Postponed)
A 0.5e-rms Noise 1.45um-Pitch CMOS Image Sensor with Reference Shared In-Pixel Differential Amplifier at 8.3Mpixel 35fps
Hideki Naganuma, Mamoru Sato, Yuhi Yorikado, Yusuke Matsumura, Eriko Kato, Takuya Toyofuku, Akihiko Kato, Yusuke Oike (SSS)
We fabricated a 1.45-um pixel, back-illuminated stacked 1/2.8-inch CIS that uses a reference-shared in-pixel differentia... [more] IST2020-24
pp.77-80
IST 2014-03-14
11:30
Tokyo NHK 3D Stacked CMOS Image Sensor
Taku Umebayashi, Tomoharu Ogita, Shunichi Sukegawa, Tsutomu Nakajima, Hiroshi Kawanobe (Sony), Ken Koseki (Sony LSI Design), Tsutomu Haruta, Hiroshi Takahashi (Sony), Keishi Inoue (Sony Semiconductor), Toshifumi Wakano, Yusuke Mada, Koji Fukumoto, Takashi Nagano, Yoshikazu Nitta, Teruo Hirayama (Sony)
We have developed 3D stacked CMOS image sensor. This technology is a Back-illuminated CIS stacking on a logic substrate.... [more] IST2014-9
p.5
IST 2014-03-14
12:00
Tokyo NHK Three-dimensional Structures for High Saturation Signals and Crosstalk Suppression in 1.20 um Pixel Back-Illuminated CMOS Image Sensor
Takekazu Shinohara, Kazufumi Watanabe (Sony Semiconductor), Takashi Abe, Kazunobu Ohta (Sony), Hajime Nakayama (Sony Semiconductor), Takafumi Morikawa, Keiichi Ohno (Sony), Dai Sugimoto (Sony Semiconductor), Shingo Kadomura, Teruo Hirayama (Sony)
We propose two technologies, vertical transfer gate (VTG) and buried shielding metal (BSM), that can be applied to 1.20 ... [more] IST2014-10
pp.7-10
 Results 1 - 3 of 3  /   
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