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| Search Results: Conference Papers |
| Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| IEICE-ICD, IEICE-SDM, IST [detail] |
2026-08-06
10:00 |
Hokkaido |
Hokkaido Univ, Pharmaceutical Sciences, Lecture Room 2
(Primary: On-site, Secondary: Online) |
[Invited Talk]
A Multi-Stacked Cell Array Architecture with Wafer-to-Wafer Cu Direct Bonding for Ultra-High-Density 3D Flash Memory beyond 1,000 Word Lines
Mitsuhiko Noda, Susumu Hashimoto, Ryuta Mizumoto, Mamoru Watanabe, Genki Sawada, Kanta Kawasaki, Masahisa Sonoda, Eiji Kamiya, Tetsu Morooka, Keisuke Nakatsuka, Hiroshi Maejima, Shigeki Kobayashi, Shinji Suzuki (Kioxia), Yukihiro Sakotsubo, Kohei Osawa, Shinya Sato, Teiji Shibasaki, Masahiro Yaegashi, Ryoichi Honma (Sandisk), Masayoshi Tagami, Katsuyuki Sekine (Kioxia) |
This paper introduces multi-stacked cell array CMOS directly bonded to array (MSA-CBA) technology for ultra-high-density... [more] |
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| IST |
2022-03-28
09:30 |
Online |
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3-Layer Stacked Pixel-Parallel CMOS Image Sensors Using Hybrid Bonding of SOI Wafers
Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (The Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (The Univ. of Tokyo) |
We report 3-layer stacked pixel-parallel CMOS image sensors developed for the first time. The hybrid bonding of silicon-... [more] |
IST2022-11
pp.5-8 |
| IST |
2020-03-27
13:30 |
Tokyo |
Kikaishinko kaikan
(Postponed) |
High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer
Shunsuke Maruyama, Shuji Manda, Ryosuke Matsumoto, Suguru Saito, Hideki Minari, Takaaki Hirano, Taizo Takachi, Nobutoshi Fujii, Yuichi Yamamoto, Yoshifumi Zaizen, Tomoyuki Hirano, Hayato Iwamoto (SSS) |
We developed a back-illuminated InGaAs image sensor with 1280x1024 pixels at 5-um pitch by using Cu-Cu hybridization con... [more] |
IST2020-16
pp.35-39 |
| IST |
2019-09-20
13:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Digital Pixel Image Sensors with Linear and Wide-Dynamic-Range Output Developed by Pixel-Wise 3-D Integration
Masahide Goto (NHK), Yuki Honda (NHK-ES), Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo) |
We report digital pixel image sensors developed by using pixel-wise three-dimensional (3D) integration technology. Photo... [more] |
IST2019-47
pp.17-20 |
| BCT, IEEE-BT |
2015-10-23
14:35 |
Yamagata |
Yamagataterrsa |
[Invited Lecture]
On Received Frame Sharing Protocol for Collaborative Interference Cancellation
Daisuke Umehara (Kyoto Inst. of Tech.) |
Let us assume that space division multiplexing (SDM) signal without precoding is transmitted at a base station (BS) with... [more] |
BCT2015-71
pp.9-12 |
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