| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| IST |
2024-03-27
15:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg.
(Primary: On-site, Secondary: Online) |
A 3.36 µm-pitch SPAD photon-counting image sensor using clustered multi-cycle clocked recharging technique with intermediate most-significant-bit readout
Takafumi Takatsuka, Jun Ogi, Yasuji Ikeda, Kazuki Hizu, Yutaka Inaoka, Shunsuke Sakama, Iori Watanabe, Tatsuya Ishikawa, Shohei Shimada, Junki Suzuki (SSS), Hidenori Maeda, Kenji Toshima (SCK), Yusuke Nonaka, Akifumi Yamamura, Hideki Ozawa, Fumihiko Koga, Yusuke Oike (SSS) |
This paper introduces the pixel front-end (PFE) circuit pitch reduction of SPAD photon count image sensor, which was rep... [more] |
IST2024-21
pp.42-45 |
| IDY, SID-JC |
2024-03-08
13:25 |
Online |
online |
[Invited Talk]
Improved Eye-Tracking Function by Combining Inertial Sensor Information for Integral 3D Display
Hisayuki Sasaki, Masanori Kano, Naoto Okaichi, Hayato Watanabe (NHK) |
In integral three-dimensional (3D) display, there is a trade-off relationship between viewing angle, resolution, and dep... [more] |
IDY2024-16
pp.5-8 |
| IDY, SID-JC |
2024-03-08
13:45 |
Online |
online |
[Invited Talk]
Si-MPPC Three-dimensional Image Sensor for Flash LIDAR
Takahide Mizuno, Hirokazu Ikeda (JAXA), Terumasa Nagano, Tatsuya Hashi, Takashi Baba, Shunsuke Adachi, Shinya Iwashina (HPK), Shigehito Shimizu, Takeshi Sekiguchi (JAXA) |
JAXA has been developing Flash LIDAR as a sensor for obstacle detection by lunar and planetary landers and for on-orbit ... [more] |
IDY2024-17
pp.9-11 |
| IST |
2022-03-28
09:30 |
Online |
|
3-Layer Stacked Pixel-Parallel CMOS Image Sensors Using Hybrid Bonding of SOI Wafers
Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (The Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (The Univ. of Tokyo) |
We report 3-layer stacked pixel-parallel CMOS image sensors developed for the first time. The hybrid bonding of silicon-... [more] |
IST2022-11
pp.5-8 |
| IST |
2022-03-28
09:55 |
Online |
|
3D Sequential Process Integraton for CMOS Image Sensor
Keiichi Nakazawa, Junpei Yamamoto, Shigetaka Mori, Shintarou Okamoto, Akito Shimizu, Koichi Baba, Nobutoshi Fujii, Mutsuo Uehara, Katsunori Hiramatsu, Hideomi Kumano, Akira Matsumoto, Kouichirou Zaitsu, Hidetoshi Ohnuma, Keiji Tatani, Tomoyuki Hirano, Hayato Iwamoto (Sony Semconductor Solutions Corp.) |
We developed a new structure of pixel transistors stacked over photodiode named “2-Layer Transistor Pixel Stacked CMOS I... [more] |
IST2022-12
pp.9-12 |
| IST |
2022-03-28
16:10 |
Online |
|
3.2 Megapixel 3D-Stacked Charge Focusing SPAD for Low-Light Imaging and Depth Sensing
Ayman Abdelghafar, Kazuhiro Morimoto, Junji Iwata, Mahito Shinohara, Hiroshi Sekine, Hiroyuki Tsuchiya, Yukihiro Kuroda, Kenzo Tojima, Wataru Endo, Yu Maehashi, Yasuharu Ota, Tomoya Sasago, Shintaro Maekawa, Shingo Hikosaka, Taikan Kanou, Aiko Kato, Tomoyuki Tezuka, Satoshi Yoshizaki, Toshiyuki Ogawa, Kosei Uehira, Alice Ehara, Fumihiro Inui, Yasushi Matsuno, Katsuhito Sakurai, Takeshi Ichikawa (Canon) |
A new generation of scalable photon counting image sensors, featuring zero read noise and 100ps temporal resolution. New... [more] |
IST2022-21
pp.47-51 |
| IST |
2021-10-21
13:40 |
Online |
|
A 3-Tap Global Shutter 5.0um Pixel with Background Canceling for 165MHz Modulated Pulsed Indirect Time-of-Flight Image Sensor
Masafumi Tsutsui, Toshifumi Yokoyama, Takahisa Ogawa, Ikuo Mizuno, Nobuyoshi Takahashi (TPSCo), Cheng Ma (Gpixel INC), Fei Wang (Orbbec Shenzhen), Joris Debondt, Jan Bogaerts (Gpixel NV), Xinyang Wang (Gpixel INC), Assaf Lahav (Tower Semiconductor) |
3-tap global shutter 5.0um pixel with background canceling for pulsed indirect time-of-flight image sensor has been deve... [more] |
IST2021-56
pp.33-36 |
| IST |
2019-09-20
13:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Digital Pixel Image Sensors with Linear and Wide-Dynamic-Range Output Developed by Pixel-Wise 3-D Integration
Masahide Goto (NHK), Yuki Honda (NHK-ES), Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo) |
We report digital pixel image sensors developed by using pixel-wise three-dimensional (3D) integration technology. Photo... [more] |
IST2019-47
pp.17-20 |
| IST |
2018-11-28
16:30 |
Tokyo |
Tamachi Campus, TITECH |
[Poster Presentation]
Multi-storied photodiode CMOS image sensor with wire grid polarizer to detect polarization information
Yoshiaki Takemoto, Yusuke Yamamoto, Yoshiharu Ajiki, Yusaku Koyama, Hideki Kato, Toru Kondo, Haruhisa Saito, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus) |
We demonstrated multi-storied photodiode CMOS image sensor with a wire grid layer to capture color image and polarizatio... [more] |
IST2018-71
pp.25-26 |
| IST |
2018-03-09
16:15 |
Tokyo |
NHK Housou-Gijyutu Lab. |
[Invited Talk]
SOI monolithic pixel technology for radiation image sensor
Yasuo Arai, Toshinobu Miyoshi, Ikuo Kurachi (KEK) |
Silicon-On-Insulator (SOI) technology is a suitable choice to realize monolithic radiation imaging device as it involves... [more] |
IST2018-25
pp.61-66 |
| IST |
2017-11-13
13:00 |
Tokyo |
Morito memorial Hall |
[Invited Talk]
A 1000fps High-Speed Vision Chip with 3D-Stacked 140GOPS Column-Parallel PEs and its Applications
Shinichi Yoshimura, Tomohiro Yamazaki, Hironobu Katayama, Shuji Uehara, Atsushi Nose, Masatsugu Kobayashi, Sayaka Shida, Takashi Izawa, Yoshinori Muramatsu (Sony Semiconductor Solutions Co.), Masaki Odahara, Kenichi Takamiya, Yasuaki Hisamatsu, Shizunori Matsumoto (Sony LSI Design Inc.), Leo Miyashita, Yoshihiro Watanabe, Masatoshi Ishikawa (University of Tokyo) |
A 1/3.2-inch 1.27Mpixel 500fps (0.31Mpixel 1000fps at 2×2 binning mode) vision chip with 3D-stacked CMOS image sensor ha... [more] |
IST2017-60
pp.1-4 |
| IST |
2017-03-10
10:00 |
Tokyo |
NHK Research Lab. Auditorium (Setagaya) |
A 1ms High-Speed Vision Chip with 3D-Stacked 140GOPS Column-Parallel PEs for Spatio-Temporal Image Processing
Masatsugu Kobayashi, Tomohiro Yamazaki, Hironobu Katayama, Shuji Uehara, Atsushi Nose, Sayaka Shida (Sony Semiconductor Solutions Co.), Masaki Odahara, Kenichi Takamiya, Yasuaki Hisamatsu, Shizunori Matsumoto (Sony LSI Design Inc.), Leo Miyashita, Yoshihiro Watanabe (University of Tokyo), Takashi Izawa, Yoshinori Muramatsu (Sony Semiconductor Solutions Co.), Masatoshi Ishikawa (University of Tokyo) |
We have developed a 1/3.2-inch 1.27Mpixel 500fps (0.31Mpixel 1000fps 2×2 binning) vision chip with 3D-stacked CMOS image... [more] |
IST2017-9
pp.3-6 |
| IST |
2016-03-11
09:45 |
Tokyo |
NHK Research Lab (Setagaya) |
Multi-storied photodiode CMOS image sensor for multiband imaging with 3D technology
Yoshiaki Takemoto, Kenji Kobayashi, Mitsuhiro Tsukimura, Naohiro Takazawa, Hideki Kato, Shunsuke Suzuki, Jun Aoki, Toru Kondo, Haruhisa Saito, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus) |
We demonstrated multiband imaging with a multi-storied photodiode CMOS image sensor (CIS), which comprises two individua... [more] |
IST2016-8
pp.5-8 |
| IST |
2016-03-11
11:40 |
Tokyo |
NHK Research Lab (Setagaya) |
A 1.1μm 33Mpixel 240fps 3D-Stacked CMOS Image Sensor with 3-Stage Cyclic-Based Analog-to-Digital Converters
Toshiki Arai, Toshio Yasue, Kazuya Kitamura, Hiroshi Shimamoto (NHK STRL), Tomohiko Kosugi, Sungwook Jun, Satoshi Aoyama (Brookman Technology), Ming-Chieh Hsu, Yuichiro Yamashita (TSMC), Hirofumi Sumi (The University of Tokyo), Shoji Kawahito (Shizuoka University) |
A 1.1μm 33Mpixel 240fps 3D-stacked CMOS image sensor with 3-stage cyclic-based ADC has been developed. The hybrid-stacki... [more] |
IST2016-12
pp.21-24 |
| AIT, IIEEJ, AS |
2016-03-09
13:15 |
Tokyo |
Tokyo Polytechnic Univ. |
3D Modeling Based on Freehand Drawings and Depth Map
Kota Takaizumi, Shaori Kurata, Hiroshi Mori, Fubito Toyama, Kenji Shoji (Utsunomiya Univ.) |
A method for 3D modeling by freehand drawings on color images with depth maps is proposed. The data of color images with... [more] |
AIT2016-123
pp.277-279 |
| ME |
2016-02-20
14:40 |
Kanagawa |
Kanto Gakuin Univ. |
High-Accuracy Projection Mapping with a Low-Cost Depth Sensor
Yohei Aoki (UEC), Keisuke Maruyama (Kyorin Univ.), Naoki Hashimoto (UEC) |
Recently, projection mapping which can change the looks of an object by projecting images attracts attention. In order t... [more] |
ME2016-24
pp.89-92 |
| IST |
2015-09-18
10:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
A 3D stacked CMOS image sensor with 16Mpixel global-shutter mode using 4 million interconnections
Toru Kondo, Yoshiaki Takemoto, Kenji Kobayashi, Mitsuhiro Tsukimura, Naohiro Takazawa, Hideki Kato, Shunsuke Suzuki, Jun Aoki, Haruhisa Saito, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus) |
We have developed a 16Mpixel 3D stacked global-shutter CMOS image sensor with pixel level interconnections using 4 milli... [more] |
IST2015-45
pp.9-12 |
| ME, AIT |
2015-05-29
13:40 |
Kyoto |
Ryukoku Univ. Kyoro Hall |
[Invited Talk]
A New Display World Created by High-resolution Organic Light Emitting Diode Display
-- Natural3D Expression based on 2D Image --
Yuichi Yanagisawa, Hisao Ikeda, Daisuke Kubota, Yoshiharu Hirakata, Shunpei Yamazaki (SEL), Michitaka Hirose (Tokyo Univ.), Masao Kasuga (Sakushin Gakuin Univ./Utsunomiya Univ.) |
We report a stereoscopic effect obtained from a two-dimensional image without using binocular parallax, which we call “n... [more] |
ME2015-67 AIT2015-94
pp.13-20 |
| IST |
2015-03-27
09:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel Signal Processors
Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake (NHK), Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. Tokyo) |
We report the first demonstration of three-dimensional (3D) integrated CMOS image sensors with pixel-parallel A/D conver... [more] |
IST2015-11
pp.5-8 |
| 3DMT |
2015-03-09
15:45 |
Ibaraki |
|
Light field display with 3D image touch interface
Ryo Higashida, Masahiro Yamaguchi (Tokyo Tech) |
We propose a touchable 3D image user interface by capturing a scattered light generated when a user touches a real image... [more] |
3DIT2015-10
pp.37-40 |
|